2015年5月11日星期一


BGA Leaded Solder Ball
Usage: For BGA Reballing in the process of BGA Chipset replacement in laptop motherboard, mobile cpu, and PS3/PS4/PSP/xbox360 controller,etc.
Composition: Sn63/Pb37
Available Size : 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.76 mm
Quantity Per Bottle: 25W

Leron Zhuomao
Shenzhen Zhuomao Technology CO,.Ltd
Building A4, Donghua Industrial Park, Bao'an,Shenzhen,China
Whatsapp/Tel: +86 150 1921 1735
Skype: Leronli515
Wechat: Leronzhuomao

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​​www.facebook.com/Leron.zhuomao

Profound BGA Lead-Free Solder Ball
Composition: Sn96.5/Ag3/Cu0.5
Available Size : 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.76mm
Quantity Per Bottle: 250000pcs


Usage: For BGA Reballing in the process of BGA Chipset replacement in laptop motherboard, mobile cpu, and PS3/PS4/PSP/xbox360 Console ,etc.

Any comments and question, you can contact :
Shenzhen Zhuomao Technology Co.,Ltd
Leron Zhuomao
www.facebook.com/leron.zhuomao
Sales9@zhuomao.com.cn
SKype : Leronli515
Tel: 0086 15019211735


2015年4月27日星期一



Seamark ZM BGA Rework Station ZM-R5860 in the production line. 
It will be available in stock in this week. Here is Leron from 
Shenzhen zhuomao technology Co.,Ltd. We mainly produce the BGA Rework Station from 2004. BGA Rework Station is widely used to repair the BGA Chip in laptop motherboard,PS3 console, playstion controller etc. 

2015年4月24日星期五

Iphone BGA chip repair process by automatic BGA rework station Zhuomao Z...





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Shenzhen Zhuomao Technology Co.,ltd

Facebook: www.facebook.com/leron.zhuomao

Whatsapp: 0086 150 1921 1735

Email: sales9@zhuomao.com.cn

Skype: Leronli515

Wechat: Leronzhuomao


Seamark ZM Technology Group

Here is Seamark ZM Technology Group(H.K.)Co.,ltd
Shenzhen Zhuomao Technology Co.,Ltd

Leron Zhuomao

Skype: Leronli515
Whatsapp: +86 150 1921 1735