BGA Leaded Solder Ball

Usage: For BGA Reballing in the process of BGA Chipset replacement in laptop motherboard, mobile cpu, and PS3/PS4/PSP/xbox360 controller,etc.

Composition: Sn63/Pb37

Available Size : 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.76 mm

Quantity Per Bottle: 25W

Leron Zhuomao
Shenzhen Zhuomao Technology CO,.Ltd
Building A4, Donghua Industrial Park, Bao'an,Shenzhen,China
Whatsapp/Tel: +86 150 1921 1735
Skype: Leronli515
Wechat: Leronzhuomao
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