Profound BGA Lead-Free Solder Ball

Composition: Sn96.5/Ag3/Cu0.5

Available Size : 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.76mm

Quantity Per Bottle: 250000pcs

Usage: For BGA Reballing in the process of BGA Chipset replacement in laptop motherboard, mobile cpu, and PS3/PS4/PSP/xbox360 Console ,etc.

Any comments and question, you can contact :

Shenzhen Zhuomao Technology Co.,Ltd

Leron Zhuomao

www.facebook.com/leron.zhuomao

Sales9@zhuomao.com.cn

SKype : Leronli515

Tel: 0086 15019211735