Automatic Optical alignment BGA Rework Station Zhuomao ZM R6200 Show

BGA Leaded Solder Ball

Usage: For BGA Reballing in the process of BGA Chipset replacement in laptop motherboard, mobile cpu, and PS3/PS4/PSP/xbox360 controller,etc.

Composition: Sn63/Pb37

Available Size : 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.76 mm

Quantity Per Bottle: 25W

Leron Zhuomao
Shenzhen Zhuomao Technology CO,.Ltd
Building A4, Donghua Industrial Park, Bao'an,Shenzhen,China
Whatsapp/Tel: +86 150 1921 1735
Skype: Leronli515
Wechat: Leronzhuomao
​​​​www.facebook.com/Leron.zhuomao

Profound BGA Lead-Free Solder Ball

Composition: Sn96.5/Ag3/Cu0.5

Available Size : 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.76mm

Quantity Per Bottle: 250000pcs

Usage: For BGA Reballing in the process of BGA Chipset replacement in laptop motherboard, mobile cpu, and PS3/PS4/PSP/xbox360 Console ,etc.

Any comments and question, you can contact :

Shenzhen Zhuomao Technology Co.,Ltd

Leron Zhuomao

www.facebook.com/leron.zhuomao

Sales9@zhuomao.com.cn

SKype : Leronli515

Tel: 0086 15019211735